Lead-Free Program (RoHS)

 

ALD's Commitment to Achieving Lead-Free and RoHS Compatibility

ALD is committed to participate in the movement to Lead (Pb)-Free. ALD defines "Lead (Pb)-Free" or "Pb-Free" to mean semiconductor products that are compatible with the current RoHS requirements for all six substances, including the requirements that lead not exceed 0.1% by weight in homogeneous material. Where designed to be soldered at high temperatures, ALD Pb-Free products are suitable for use in specified lead-free processes.

On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006. ALD recognizes that customers require early availability of Pb-Free products and ALD has set a schedule for Pb-Free conversion in response to customers needs, targeting to have the majority of ALD products available Pb-Free by the end of 2005.

Lead-Free Conversion Overview and "Green" Mold Compound Program

ALD´s lead-free integrated circuits meet the proposed RoHS thresholds for cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Most of our lead-free integrated circuits also meet the proposed thresholds for lead, with the remaining devices on a near-term schedule for qualification and availability. This status is based on ALD´s current understanding of RoHS and ALD´s knowledge of the materials that go into its products.

Lead (Pb)-Free Orderable: 'L' indicates a device can be ordered RoHS compatible, including a lead concentration that does not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, ALD Pb-Free products are suitable for use in specified lead-free processes.

In addition to the RoHS substances, ALD is addressing additional substances of concern through our "Green" mold compound initiative. ALD defines "Green" to mean Lead (Pb)-Free and in addition, uses package materials that do not contain halogens, including bromine (Br), or antimony (Sb) above 0.1% of total product weight.

Important Information

ALD's latest knowledge and belief on the subject of lead-free and "Green" molding compound is provided as appropriate. ALD bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ALD has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted testing or analysis on incoming materials and chemicals on its own. Customers are advised to verify and qualify such information, materials, and products in the context of their own individual requirements. In no event shall ALD's liability arising out of such information, materials and products exceed the total purchase price of the ALD part(s) sold by ALD to Customer. For additional information, please see terms of use for additional terms and conditions; ALD Warranty Information; or contact an ALD Representative.

Ordering Information

After Jan. 1, 2005, ALD will begin shipping Pb-Free capable integrated circuit "Green" (IC) components using packing labels that align with Joint Electronic Device Engineering Council (JEDEC) standards. ALD began using an identification mark as well as a part number suffix "L" on packing labels for devices that utilize a Pb-Free finish, a "Green" molding compound, and a material set rated for use in lead-free reflow processes. To place an order for an ALD part, please specify the part number with suffix "L", and specify "Leadfree" or "Green" on the purchase order. Should you have further questions about this program, please contact your ALD Representative.

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